WEICON 10044884 Easy-Mix HT 180 Epoxy Adhesive

WEICON Easy-Mix HT 180 is a 2-component adhesive based on epoxy resin with high temperature resistance up to +180 °C (+356 °F); short-term up to +230 °C (+446 °F). The adhesive is highly viscous and stable which also makes it suitable for vertical applications. It is impact- and shock-resistant, has a long pot life, cures at room temperature and is machinable after curing. The adhesive is particularly suitable for the bonding of composite materials and metal and can be spot-welded while curing. Easy-Mix HT 180 can also be used on plastics, ceramics, glass, stone or wood and is suitable for adhesions where larger tolerances have to be bridged. Due to special fillers, it is possible to achieve a non-varying and reliable adhesive joint of at least 0.20 - 0.25 mm. The high temperature resistance enables the bonding of components, which are thermo-coated (powder-coated) after curing.

Specification
Name
WEICON 10044884 Easy-Mix HT 180 Epoxy Adhesive
SKU
10044884
Brand
Condition
New
Adhesive Properties
Pot Life at 20 °C (10 ml batch) 60 min
Handling Strength (35% strength) 120 min
Working Strength (50% strength) 4 h
Final Strength (100% strength) 24 h
Shrinkage 0.3%
Mechanical Properties After Curing
Tensile Strength (DIN EN ISO 527-2) 27 MPa
E-Modulus (Tensile) (DIN EN ISO 527-2) 2300–2700 MPa
Compressive Strength (DIN EN ISO 604) 52 MPa
Bending Strength (DIN EN ISO 178) 46 MPa
Hardness (Shore D) (DIN ISO 7619) 80
Lap Shear Strength (DIN EN 1465, thickness 1.5 mm)
Steel 1.0338 (sandblasted) 23 N/mm²
Stainless Steel V2A (sandblasted) 24 N/mm²
Aluminium (sandblasted) 13 N/mm²
Galvanized Steel 8 N/mm²
PVC-rigid (roughened) 11 N/mm²
CFRP 22 N/mm²
Thermal Parameters
Temperature Resistance -50 °C to +180 °C, briefly up to +230 °C
Tg After Curing (Room Temp., DSC) 54.4 °C
Tg After Tempering (120°C, DSC) 44.7 °C
Temperature Conductivity 0.172 mm²/s
Thermal Conductivity (DIN EN ISO 22007-4) 0.26 W/m·K
Heat Capacity (DIN EN ISO 22007-4) 1.335 J/(g·K)
Electrical Parameters
Resistance (DIN EN 62631-3-1) 2.48 · 10¹¹ Ω·m
Dielectric Strength (DIN EN 60243-1, 20°C) 18 kV/mm