WEICON 4024596058784 HP Mineral Filled Epoxy Resin System

WEICON HP is a 2-component epoxy resin with longer curing time, enormous impact strength as well as high residual elasticity and abrasion resistance. Due to its high elongation at break and paste-like texture, WEICON HP can be used for repairs, as abrasion protection as well as for lining heavily stressed equipment. The adhesive also shows excellent adhesion to wet and damp surfaces and in underwater applications.

Specification
Name
WEICON 4024596058784 HP Mineral Filled Epoxy Resin System
SKU
4024596058784
Brand
Condition
New
Base Epoxy
Filler Mineral
Texture Pasty
Colour White
Processing
Processing temperature +15°C to +40°C
Component temperature >3°C above dew point
Relative air humidity <85%
Mixing ratio by weight 100:83
Mixing ratio by volume 100:95
Viscosity of the mixture at +25°C 550,000 mPa·s
Density of the mixture 1.5 g/cm³
Consumption (Layer thickness 1.0 mm) 1.5 kg/m²
Max. layer thickness per step 10 mm